The Alpitronic HYC50 Hardware Teardown for Pwn2Own Automotive 2026
As we ramp up to the premier automotive and charging station hacking competition, Pwn2Own Automotive 2026 in Tokyo, the Trend Micro Zero Day Initiative (ZDI) is providing a preliminary look at one of the main targets: the Alpitronic HYC50 High-Power Charger.
The HYC50 series represents the leading edge of fast-charging infrastructure, blending complex high-voltage power electronics with a robust, networked digital control system. For Pwn2Own contestants, the digital attack surface is often the most accessible path to a top-tier bounty. This post serves as a hardware identification primer, guiding researchers through the core components that make up the device's control and low-voltage sections.
This is strictly a hardware reconnaissance report. We encourage all participants to begin their deep-dive analysis ahead of the contest.
Section 1: The Development Hardware Enclosure
Participants in Pwn2Own Automotive 2026 will be provided with a modified hardware setup to simplify the research process. This setup isolates the low-voltage control and digital boards from the high-voltage power stack, allowing for safer and more focused analysis.
The following image shows the custom enclosure housing the core digital and communication components extracted from the larger HYC50 unit.
The low-voltage control and digital stack mounted in the custom development case. Note the external power inputs and clearly labeled network ports for easy connectivity.
This case contains the primary application processor, communication interfaces (Ethernet, CAN), and critical memory components that govern the charger's operation, payment, and network connectivity. Additionally, you will find the touchscreen and NFC interfaces readily accessible on the front of the case.
Section 2: Core Digital Control Board (DCB)
The central brain of the Alpitronic HYC50 is the main digital control board. This PCB is responsible for managing the charger's state machine, handling OCPP (Open Charge Point Protocol) communication, managing user authentication, and orchestrating the power modules. The main application processor and its memoires reside on a customized System On a Module (SOM) that attaches to the main board via a 200 pin SO-DIMM header. We’ll discuss the SOM specifically in the next section.
Top of the main Digital Control Board (DCB)
Bottom of the main Digital Control Board (DCB)
The DCB features several key components of interest to security researchers:
Component Functionality and additional information Power Line Communication Controller (PLC) Two PLC units provide communication to the vehicle. The RED Beet E 1.1 devices are utilized for this purpose. These are alternately known as SECC (Supply Equipment Communication Controllers). Ethernet Interfaces Two RJ45 Ethernet interfaces reside on the board. As these are located near a maintenance access hatch on the enclosure, the interfaces are intended to be used by installers and technicians to access the management interface of the charger. Local MPU An STM32G0B1 is utilized on the DCB, likely for real time control of the charging process. Note the possible JTAG header footprint nearby in the pictures below. SOM The main processor subsystem is located on a 208 pin SO-DIMM that can be plugged into the DCB. Connectors Near SOM The high-density connectors near the SOM interface the other boards of the system. This includes the touch screen LCD and the SIM card communications board. SOM Console Header There is a 4-pin unpopulated header on the DCB near the SOM socket. Silkscreen reads “CON_SOM_UART”, suggesting a console port. Its operational status is unknown.Close-up of the PLC controller
Ethernet interfaces for accessing the management interface
The SOM residing on the DCB along with the LCD and COMM board interfaces. Note the 4-pin header marked “CON_SOM_UART” in the upper left corner of the picture.
The local MPU (STM32G0B1) and possible test ports (missing conformal coating)
Section 3: SOM
The main processing components of the charger reside on a 208-pin module that is plugged into the DCB. The module is custom, however it is heavily based on the VAR-SOM-6UL design produced by Variscite. It is a variant that contains an eMMC device but appears to be lacking the Wi-Fi devices that a standard VAR-SOM-6UL is advertised with. That’s not surprising because the radio functions of the charger are handled by a separate board. Thus, it is very possible that this “custom” SOM is simply a cost-reduced version with some unneeded parts de-populated from the off-the-shelf version.
Top and Bottom views of the SOM (System On a Module)
The custom SOM features several key components of interest to security researchers:
Component Functionality and additional information Main SoC/CPU The primary processor, an i.MX6 (MCIMX6G2AVM07 AB). This runs the operating system (likely embedded Linux or a RTOS) and the core application code. DRAM/RAM Soldered DDR memory adjacent to the i.MX6 on the top side. Part number reads K4B4G1646E-BMMA, which translates to a 512MB DDR3L device. Flash Memory A surface-mounted eMMC Flash chip sits on the back side of the SOM. Part number reads SDINBDG4-8G-XI1 and is thus an 8GB device.Main top side components. i.MX6 and DDR memory
Main bottom side component. SanDisk eMMC memory
Section 4: Communication Board (COMM)
The HYC50 relies on several interfaces for communication, and much of that capability is housed on the COMM board attached to the door of the enclosure. This board is connected to the DCB through the single large connector. There appear to be two 4G LTE radios and they share the same antenna. Two SIM card slots exist, possibly to support those radios. There’s a third radio module that’s likely providing the Wi-Fi and Bluetooth functions on its separate antenna. Thereis also a USB port, but it is not accessible from the outside of the enclosure. Finally, this board appears to interface to the screen’s touch function while the display appears to fed by the DCB directly. In addition to the board pictures, a picture of its arrangement in the charger’s enclosure will be included for clarity.
Top side of the communication board (COMM) showing two 4G LTE controllers
Bottom side of the COMM board
HYC50 enclosure door layout
The COMM board features several key components of interest to security researchers:
Component Functionality and additional information 4G LTE Radios Two QUECTEL EG915U-EU sharing an antenna. There are two SIM card slots as well. Wi-Fi/BT Radio Likely an ESP32-WROOM or ESP32-WROVER, based on the QR code shown and its package and pin count. NFC board Interface NFC board interfaces to the COMM board USB Port A type A USB port on the board. Not exposed outside the enclosure. Function unknown.The 4G LTE module (lower left) and the Wi-Fi/BT module (upper right)
Section 5: Additional Observations
1) The HYC50 is a mature product with documentation available online. Do not neglect to search for documents that might assist your effort. Installation and operational manuals exist in various locations.
2) If you are one of the few who were approved to receive a development case for research, please be aware that these are custom, hand-built, experimental devices. Before powering up, look/listen for any fasteners that may have come loose during shipping. Correct those before applying power to the unit to avoid damage.
Conclusion
The Alpitronic HYC50 offers a rich and complex target for Pwn2Own researchers. This preliminary look identifies the core digital components, memory, and — crucially — the physical debug and manufacturing interfaces that may be leveraged for the contest.
We look forward to seeing the innovative research that will be brought to bear on the HYC50 at Pwn2Own Automotive 2026. Happy hunting, and may the bounty be ever in your favor!
Follow the team on Twitter, Mastodon, LinkedIn, or Bluesky for the latest in exploit techniques and security patches and visit the Pwn2Own Automotive 2026 page for rule updates and bounty lists.